JOURNAL OF ELECTRONIC PACKAGING

The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.

电子包装杂志发表论文，使用实验和理论(分析和计算机辅助)的方法、方法和技术来解决和解决在电子和光子学组件、设备和系统的分析、设计、制造、测试和操作中遇到的各种机械、材料和可靠性问题。