MICROELECTRONICS INTERNATIONAL

Microelectronics International provides an authoritative, international and independent forum for the critical evaluation and dissemination of research and development, applications, processes and current practices relating to advanced packaging, micro-circuit engineering, interconnection, semiconductor technology and systems engineering within this fast moving and changing technological field. It represents a current, comprehensive and practical information tool. The journal comprises a multi-disciplinary study of the various technologies, processes and current practices associated with the design, manufacture, assembly and various applications of miniaturized electronic devices and advanced packages.

微电子国际提供了一个权威的、国际的和独立的论坛，在这个快速发展和变化的技术领域内，对与先进封装、微电路工程、互连、半导体技术和系统工程相关的研究和开发、应用、过程和当前实践进行关键评估和传播。它代表了一种当前的、全面的、实用的信息工具。该杂志包括一个多学科研究的各种技术，过程和当前的实践与设计，制造，装配和各种应用的微型电子设备和先进的软件包。